Position Details

POSTDOC 25-53

Image
Science

Field

Microelectronics

Project Name

Study of Chip-To-Wafer (C2W) Underfill Encapsulation Process Parameters on Void Formation using Numerical Simulation and Machine Learning Algorithm

KPI

Science Field

Produce two (2) publications as the First Author in ISI Web of Science indexed journals (Q1/Q2 in the Journal Citation Report (JCR) only).

Non-Science Field

Produce two (2) publications as the First Author in Scopus indexed journals (Q1/Q2 in SCImago Journal Rank (SJR) or JCR). Publications in JCR journals are highly encouraged.

•FPD publications/KPIs will be considered as additional KPIs to the existing KPIs of the Supervisor set by the University.

This KPI is the primary criterion for evaluation and consideration for reappointment (if applicable).

Criteria

•Awarded a Doctor of Philosophy (Ph.D.) degree.

•Good academic merit and research output in the last three (3) years, particularly in publications:

Science Field

Two (2) publications in journals indexed in the ISI Web of Science (Q1/Q2 in the Journal Citation Report (JCR) only) with one (1) of the publications as the First Author.

OR One (1) Patent.

Non-Science Field

Two (2) publications in journals indexed by Scopus with one (1) of the publications as the First Author. Preference is given to publications in JCR.

•The field of appointment is open but must be relevant to the supervisor identified according to the school/center of excellence.

Notes

A postdoctoral position is available for a research project focusing on the integration of computation fluid dynamics (CFD), machine learning (ML), artificial intelligence (AI), and image processing in the chip-to-wafer underfill encapsulation process.

Open to

Malaysian & Non-Malaysian

School: SCHOOL OF MECHANICAL ENGINEERING

Supervisor's Name': MOHAMAD AIZAT BIN ABAS

Contact: 012-4573749 | aizatabas@usm.my

Salary: RM 5,500.00

Number of Position: 1

Closing Date: 04/05/2026

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